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Processor Intel Core i7 6700


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  • LGA 1151
  • Unlocked Processor
  • DDR4 & DDR3L Support
  • Display Resolution up to 4096×2304
  • Intel Turbo Boost Technology
  • Compatible with Intel 100 Series Chipset Motherboards

 

Rp 4,290,000

Processor Intel Core i7 6700

Processor Intel Core i7 6700

General information
Type CPU / Microprocessor
Market segment Desktop
Family Intel Core i7
Model number 
i7-6700K
CPU part numbers
  • CM8066201919901 is an OEM/tray microprocessor
  • BX80662I76700K is a boxed processor (English version)
  • BXC80662I76700K is a boxed processor (Chinese version)
Frequency 
4000 MHz
Turbo frequency 4200 MHz
Bus speed 
8 GT/s DMI
Clock multiplier 
40
Package 1151-land Flip-Chip Land Grid Array
Socket Socket 1151
Size 1.48″ x 1.48″ / 3.75cm x 3.75cm
Introduction date August 5, 2015
Architecture / Microarchitecture
Microarchitecture Skylake
Processor core 
Skylake-S
Core stepping 
R0 (SR2BR)
Manufacturing process 0.014 micron
Data width 64 bit
The number of cores 4
The number of threads 8
Floating Point Unit Integrated
Level 1 cache size
4 x 32 KB instruction caches
4 x 32 KB data caches
Level 2 cache size 
4 x 256 KB caches
Level 3 cache size 8 MB shared cache
Physical memory 32 GB
Multiprocessing Uniprocessor
Features
  • MMX instructions
  • SSE / Streaming SIMD Extensions
  • SSE2 / Streaming SIMD Extensions 2
  • SSE3 / Streaming SIMD Extensions 3
  • SSSE3 / Supplemental Streaming SIMD Extensions 3
  • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4 
  • AES / Advanced Encryption Standard instructions
  • AVX / Advanced Vector Extensions
  • AVX2 / Advanced Vector Extensions 2.0
  • BMI / BMI1 + BMI2 / Bit Manipulation instructions
  • F16C / 16-bit Floating-Point conversion instructions
  • FMA3 / 3-operand Fused Multiply-Add instructions
  • EM64T / Extended Memory 64 technology / Intel 64
  • NX / XD / Execute disable bit
  • HT / Hyper-Threading technology 
  • VT-x / Virtualization technology 
  • VT-d / Virtualization for directed I/O
  • TBT 2.0 / Turbo Boost technology 2.0
  • TSX / Transactional Synchronization Extensions
Low power features Enhanced SpeedStep technology 
Integrated peripherals / components
Integrated graphics GPU Type: HD 530
Microarchitecture: Gen 9 LP
Base frequency (MHz): 350
Maximum frequency (MHz): 1150
The number of supported displays: 3
Memory controller The number of controllers: 1
Memory channels: 2
Supported memory: DDR3L-1333, DDR3L-1600, DDR4-1866, DDR4-2133
DIMMs per channel: 2
Maximum memory bandwidth (GB/s): 34.1
Other peripherals
  • Direct Media Interface 3.0
  • PCI Express 3.0 interface (16 lanes)
Electrical / Thermal parameters
Thermal Design Power
91 Watt

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